HP VIP Labels & Flexible Packaging Innovation Summit | Singapore | 10-12 June
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The HP Labels & Packaging VIP Innovation Summit takes place this June in Singapore, bringing together business leaders from across the industry for two days focused on growth, innovation, automation and the future of digital production.
From live production demonstrations on the HP Indigo 6K+ and 200K, to AI-driven workflows, sustainability initiatives, embellishment, finishing and real-world customer success stories, the agenda has been designed to deliver practical insight and meaningful discussion.
The program also includes hands-on experiences, partner showcases and industry site visits, providing attendees with the opportunity to see applications, workflows and production environments up close.
📍 Singapore
📅 11–12 June 2026
🏨 Hotel check-in: 10 June
If you’re exploring what’s next for your labels or packaging business, we encourage you to attend. For a more personalised experience and guidance around the event, please reach out to Mark Daws or Wayne Quayle from our team.
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